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XA7Z030-1FBG484Q

484 Terminations-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XA7Z030-1FBG484Q
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 338
  • Description: 484 Terminations-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

Details

Tags

Parameters
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Power Supplies 11.8V
Number of I/O 130
Speed 667MHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
UV Erasable N
Height Seated (Max) 2.54mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.There is a 484-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Automotive, AEC-Q100, Zynq?-7000 XA.The average operating temps for this SoC meaning should be -40°C~125°C TJ.This SoC security combines Kintex?-7 FPGA, 125K Logic Cells, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.130 I/Os in total are included in this SoC part.It is really beneficial to have system on a chip since there are 484 terminations in total.In the same way that other high-quality Other uPs/uCs/Peripheral ICs will do, it is also capable of providing outstanding performance.In order to use system on chip, you will need a power supply of 11.8V.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XA7Z030-1FBG484Q System On Chip (SoC) applications.

  • Embedded systems
  • Medical
  • Self-aware system-on-chip (SoC)
  • Sensor network-on-chip (sNoC)
  • Keywords
  • Print Special Issue Flyer
  • Networked Media Encode/Decode
  • Healthcare
  • Mobile market
  • Samsung galaxy gear

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