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XAZU2EG-1SBVA484Q

484 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XAZU2EG-1SBVA484Q
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 716
  • Description: 484 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Number of Terminations 484
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Height Seated (Max) 2.61mm
Length 19mm
Width 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.It has been assigned a package 484-BFBGA, FCBGA by its manufacturer for this system on a chip.With 1.2MB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MPU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.Temperatures should be -40°C~125°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells is important.Tray package houses this SoC system on a chip.In total, this SoC part has 128 I/Os.Use a power supply with a voltage of 0.85V if possible.It is really beneficial to have system on a chip since there are 484 terminations in total.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

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XAZU2EG-1SBVA484Q System On Chip (SoC) applications.

  • Central alarm system
  • ARM processors
  • External USB hard disk/SSD
  • Central alarm system
  • Smart appliances
  • Sports
  • Medical Pressure
  • Test and Measurement
  • Mobile computing
  • Functional safety for critical applications in the industrial sectors

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