XAZU2EG-1SFVA625I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 625-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 625 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.85V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B625 |
| Number of I/O | 128 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 1.2MB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Architecture | MPU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Height Seated (Max) | 3.43mm |
| Length | 21mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package as per the manufacturer's specifications.With 1.2MB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MPU, FPGA technique for its internal architecture.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.This SoC part has a total of 128 I/Os.Ideally, a power supply with a voltage of 0.85V should be used.In total, there are 625 terminations, so system on a chip is really aided by this.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU2EG-1SFVA625I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Three phase UPS
- Smartphones
- ARM support modules
- ARM processors
- Industrial Pressure
- sequence controllers
- AC drive control module
- Automotive gateway
