Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-BFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Number of Terminations |
484 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.85V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of I/O |
128 |
Speed |
500MHz, 1.2GHz |
RAM Size |
1.8MB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, I2C, SPI, UART/USART, USB |
Architecture |
MPU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Height Seated (Max) |
2.61mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? core processor(s).
A core processor Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 484-BFBGA, FCBGA by its manufacturer for this system on a chip.The 1.8MB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MPU, FPGA architecture for its internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells, an important feature to keep in mind.Tray package houses this SoC system on a chip.In total, this SoC part has 128 I/Os.Ideally, a power supply with a voltage of 0.85V should be used.As a result, there are 484 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.
Quad ARM? Cortex?-A9 MPCore? with CoreSight?, Dual ARM? Cortex?-R5 MPCore? with CoreSight? processor.
1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU3EG-1SBVA484Q System On Chip (SoC) applications.
- Microcontroller based SoC ( RISC-V, ARM)
- Print Special Issue Flyer
- Medical Pressure
- Video Imaging
- Communication interfaces ( I2C, SPI )
- AC-input BLDC motor drive
- Communication network-on-Chip (cNoC)
- Robotics
- Sensor network-on-chip (sNoC)
- Personal Computers