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XAZU3EG-1SFVC784Q

784 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XAZU3EG-1SFVC784Q
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 332
  • Description: 784 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V (Kg)

Details

Tags

Parameters
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max) 3.32mm
Length 23mm
Width 23mm
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.A SoC chip with 1.8MB RAM is provided for users to enjoy reliable performance.The SoC design uses MPU, FPGA architecture for its internal architecture.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.This SoC meaning should have an average operating temperature of -40°C~125°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.128 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 784 terminations, so system on a chip is really aided by this.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU3EG-1SFVC784Q System On Chip (SoC) applications.

  • Efficient hardware for inference of neural networks
  • CNC control
  • Samsung galaxy gear
  • Microprocessors
  • Communication network-on-Chip (cNoC)
  • Robotics
  • Automotive gateway
  • Industrial AC-DC
  • Medical Pressure
  • Industrial

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