XAZU3EG-L1SFVA625I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 625-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 625 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B625 |
| Number of I/O | 128 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 1.8MB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Architecture | MPU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Height Seated (Max) | 3.43mm |
| Length | 21mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.According to the manufacturer, this system on a chip has a package of 625-BFBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 1.8MB RAM.A MPU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells is important.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 128 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.There are 625 terminations in total and that really benefits system on a chip.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU3EG-L1SFVA625I System On Chip (SoC) applications.
- Wireless sensor networks
- Avionics
- Mouse
- Servo drive control module
- Healthcare
- Measurement tools
- DC-input BLDC motor drive
- ARM
- Body control module
- Cyber security for critical applications in the aerospace
