XC1701LPD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2000 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC1701L |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 1Mb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.01mA |
| Organization | 1MX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC1701LPD8C Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for the external environment.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using OTP.With a voltage of 3V~3.6V, it is powered.The memory device is mounted in Through Hole.There is a limit of 1Mb MB for the amount of data that can be stored.To find other similar parts, search for "XC1701L".3.3V is the required supply voltage.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.A CONFIGURATION MEMORY memory chip is shown here.In reflow soldering procedure, the temperature should be controlled to no higher than 225.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.01mA.Parts include 8 pins.I would like to mention that this is a memory IC that will be able to work at a 15MHz frequency, so I will mention that.The memory's I/O is configured to be COMMON in terms of its configuration.A power supply that is rated at 3.3V is recommended for use with this product.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.
XC1701LPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1701LPD8C Applications
There are a lot of Xilinx Inc. XC1701LPD8C applications of configuration proms for FPGAs.
- main computer memory
- eSRAM
- telecommunications
- graphics card
- hard disk drive (HDD)
- multimedia computers
- Camcorders
- Cache memory
- data buffer
- nonvolatile BIOS memory
