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XC1701LPDG8I

Through Hole 1Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC1701L unknown


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC1701LPDG8I
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 223
  • Description: Through Hole 1Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC1701L unknown (Kg)

Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature -40°C~85°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1701L
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Clock Frequency 15MHz
Supply Current-Max 0.01mA
Organization 1MX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status RoHS Compliant

XC1701LPDG8I Overview


This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external environment.-40°C~85°C license holder.The OTP programming language can be used to program it.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in the Through Hole position.There is a limit of 1Mb MB for the amount of data that can be stored.To find other similar parts, search for "XC1701L".3.3V is the required supply voltage.A termination with different functions in the 8 axis.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.Reflow soldering should be done at 250°C maximum.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.The memory chip is allowed to operate from a voltage no higher than 0.01mA.In the package, you will find a set of 8 pins.I think it's important to point out that this is a memory IC that has a 15MHz frequency that can be operated at.Memory is configured as COMMON for memory's I/O.Memory is recommended that a 3.3V power supply be used.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.

XC1701LPDG8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1701LPDG8I Applications


There are a lot of Xilinx Inc. XC1701LPDG8I applications of configuration proms for FPGAs.

  • Cache memory
  • mainframes
  • printers
  • DVD disk buffer
  • multimedia computers
  • personal computers
  • nonvolatile BIOS memory
  • embedded logic
  • workstations,
  • main computer memory

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