XC1701LPDG8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 2004 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC1701L |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 1Mb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.01mA |
| Organization | 1MX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | RoHS Compliant |
XC1701LPDG8I Overview
This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external environment.-40°C~85°C license holder.The OTP programming language can be used to program it.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in the Through Hole position.There is a limit of 1Mb MB for the amount of data that can be stored.To find other similar parts, search for "XC1701L".3.3V is the required supply voltage.A termination with different functions in the 8 axis.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.Reflow soldering should be done at 250°C maximum.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.The memory chip is allowed to operate from a voltage no higher than 0.01mA.In the package, you will find a set of 8 pins.I think it's important to point out that this is a memory IC that has a 15MHz frequency that can be operated at.Memory is configured as COMMON for memory's I/O.Memory is recommended that a 3.3V power supply be used.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.
XC1701LPDG8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1701LPDG8I Applications
There are a lot of Xilinx Inc. XC1701LPDG8I applications of configuration proms for FPGAs.
- Cache memory
- mainframes
- printers
- DVD disk buffer
- multimedia computers
- personal computers
- nonvolatile BIOS memory
- embedded logic
- workstations,
- main computer memory
