XC17512LPD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2000 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17512L |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 512kb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.005mA |
| Organization | 512KX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17512LPD8C Overview
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging outside of Tube.Licensed to operate in 0°C~70°C.Using OTP, you can program it.This device is fed with a voltage of 3V~3.6V which is applied to it.I have mounted this memory device in Through Hole.Data storage is limited to a size of 512kb bytes.Try searching "XC17512L" for more parts.Supply voltage 3.3V is required.Different types of 8 terminations are available with different functions.Using this memory device with a maximum voltage of 3.6V is possible.There must be a minimum voltage of 3V to supply the device with the power it needs.Using CONFIGURATION MEMORY memory chips, this is what you get.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.FPGA has pins on the 8 axis.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.005mA.As part of the package, the part comes with a set of 8 pins.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.There is a configuration of COMMON for the memory's I/O.3.3V power supplies are recommended.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.
XC17512LPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17512LPD8C Applications
There are a lot of Xilinx Inc. XC17512LPD8C applications of configuration proms for FPGAs.
- hard disk drive (HDD)
- eSRAM
- Cache memory
- eDRAM
- cell phones
- networks
- telecommunications
- multimedia computers
- DVD disk buffer
- supercomputers
