Parameters |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Number of Pins |
20 |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
Published |
2000 |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn85Pb15) |
Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
HTS Code |
8542.32.00.61 |
Technology |
CMOS |
Voltage - Supply |
3V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
225 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC17512L |
Pin Count |
20 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
3.6V |
Power Supplies |
3.3V |
Supply Voltage-Min (Vsup) |
3V |
Programmable Type |
OTP |
Memory Size |
512kb |
Operating Mode |
SYNCHRONOUS |
Clock Frequency |
15MHz |
Supply Current-Max |
0.005mA |
Organization |
512KX1 |
Output Characteristics |
3-STATE |
Memory Width |
1 |
Standby Current-Max |
0.00005A |
Memory Density |
524288 bit |
Parallel/Serial |
SERIAL |
I/O Type |
COMMON |
Memory IC Type |
CONFIGURATION MEMORY |
Height Seated (Max) |
2.6416mm |
Length |
12.827mm |
Width |
7.5184mm |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
XC17512LSO20C Overview
This package makes use of the 20-SOIC (0.295, 7.50mm Width) programming language.Packaging for external use.As a qualified employee, I can operate within 0°C~70°C.Through OTP, it is programmable.An electric current of 3V~3.6V is applied to it.I have mounted this memory device in Surface Mount.A data storage size of 512kb is allowed.Search "XC17512L" for related parts.In order for it to function, it requires a voltage supply of 3.3V.There are different functions that can be applied on the 20 axis when it comes to terminating.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.Reflow soldering should be done at 225°C maximum.There are 20 pins on it.In this memory, data is transmitted using the SERIAL process.The memory chip will not operate at a voltage above 0.005mA.Parts come with 20 pins.When it comes to speed, this is a memory IC that can work at a frequency of 15MHz, which is very fast.There is a configuration of COMMON for the memory's I/O.Memory is recommended to use a 3.3V power supply.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.
XC17512LSO20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17512LSO20C Applications
There are a lot of Xilinx Inc. XC17512LSO20C applications of configuration proms for FPGAs.
- nonvolatile BIOS memory
- telecommunications
- eDRAM
- personal computers
- servers
- data buffer
- networking
- personal digital assistants
- mainframes
- cell phones