XC17512LSO20I
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Number of Pins | 20 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 2000 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17512L |
| Pin Count | 20 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.005mA |
| Organization | 512KX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 2.6416mm |
| Length | 12.827mm |
| Width | 7.5184mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17512LSO20I Overview
An interesting 20-SOIC (0.295, 7.50mm Width) package is used for this.External packaging for the Tube series.A qualified individual who has the ability to operate within -40°C~85°C.The OTP programming language can be used to program it.An electric current of 3V~3.6V is applied to it.The memory device is mounted in Surface Mount.Try searching "XC17512L" for more parts.In order for it to function, it requires a voltage supply of 3.3V.With different functions, 20 terminations can be used.Using this memory device with a maximum voltage of 3.6V is possible.3V must be the minimum voltage supplied to the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.Pins on it are 20-shaped.As a result of the SERIAL process, data is transmitted from this memory.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 20 pins.Using a 15MHz frequency, this memory IC can work at high speeds.There is a COMMON configuration for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.Therefore, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included in order to better meet customer needs.
XC17512LSO20I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17512LSO20I Applications
There are a lot of Xilinx Inc. XC17512LSO20I applications of configuration proms for FPGAs.
- nonvolatile BIOS memory
- DVD disk buffer
- Cache memory
- eSRAM
- embedded logic
- cell phones
- printers
- workstations,
- personal digital assistants
- supercomputers
