XC1765ELSOG8C
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| JESD-609 Code | e3 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 8 |
| Terminal Finish | MATTE TIN |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 8 |
| JESD-30 Code | R-PDSO-G8 |
| Qualification Status | COMMERCIAL |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 65kb |
| Operating Mode | SYNCHRONOUS |
| Organization | 64KX1 |
| Memory Width | 1 |
| Memory Density | 65536 bit |
| Parallel/Serial | SERIAL |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 1.7272mm |
| Length | 4.9276mm |
| Width | 3.937mm |
| RoHS Status | ROHS3 Compliant |
XC1765ELSOG8C Overview
An interesting 8-SOIC (0.154, 3.90mm Width) package is used for this.External packaging for the Tray series.Qualified to perform a variety of tasks within the 0°C~70°C environment.Using the OTP axis, it can be programmed to do whatever you want.FPGA is fed wFPGAh a voltage of 3V~3.6V.There is a memory device mounted in Surface Mount.There is a limit to the size of data storage of 65kb bytes.The supply voltage of the device must be 3.3V in order to operate correctly.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.A CONFIGURATION MEMORY memory chip is shown here.Reflow soldering should be done at 260°C maximum.A SERIAL-processing method is used to transfer data through this memory.With the part are included 8 pins.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC1765ELSOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
XC1765ELSOG8C Applications
There are a lot of Rochester Electronics, LLC XC1765ELSOG8C applications of configuration proms for FPGAs.
- cell phones
- multimedia computers
- embedded logic
- personal digital assistants
- hard disk drive (HDD)
- personal computers
- nonvolatile BIOS memory
- telecommunications
- eDRAM
- main computer memory
