XC1765EPDG8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2004 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Termination | Through Hole |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 4.75V~5.25V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC1765E |
| Pin Count | 8 |
| Supply Voltage-Max (Vsup) | 5.25V |
| Power Supplies | 5V |
| Supply Voltage-Min (Vsup) | 4.75V |
| Programmable Type | OTP |
| Interface | Serial |
| Memory Size | 65kb |
| Memory Type | PROM |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.01mA |
| Organization | 64KX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 64 kb |
| Standby Current-Max | 0.00005A |
| I/O Type | COMMON |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
XC1765EPDG8C Overview
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging for external use.Qualified to operate within 0°C~70°C.FPGA is programmable through OTP.A voltage of 4.75V~5.25V is applied to it in order to power it.This memory device is mounted in Through Hole.Data storage is limited to a size of 65kb bytes.To find other similar parts, search for "XC1765E".The supply voltage should be 5V.There are different functions associated with 8 terminations.A maximum voltage of 5.25V can be applied to this memory device.FPGA is imperative that the voltage of the device supply is at least 4.75V if the device is to work properly.In reflow soldering, the temperature should be controlled to a maximum of 250 degrees during the process.FPGA is equipped wFPGAh 8 pins.A memory chip can operate at a voltage no greater than 0.01mA.8 pins are set with the part.Speaking of speed, this is a memory IC that can work at a 10MHz frequency.The I/O configuration of the memory is COMMON.The use of a 5V power supply is recommended in order to achieve best results.For better service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.The PROM memory is also referred to as the X memory.
XC1765EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory
XC1765EPDG8C Applications
There are a lot of Xilinx Inc. XC1765EPDG8C applications of configuration proms for FPGAs.
- data buffer
- Cache memory
- cell phones
- hard disk drive (HDD)
- personal computers
- networks
- Camcorders
- DVD disk buffer
- embedded logic
- nonvolatile BIOS memory
