XC17S10XLPDG8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S10XL |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 100kb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.005mA |
| Organization | 95752X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Memory Density | 95752 bit |
| I/O Type | COMMON |
| Memory IC Type | MEMORY CIRCUIT |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | RoHS Compliant |
XC17S10XLPDG8C Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging for external use.Qualified to operate within 0°C~70°C.OTP is the program that allows it to be programmed.FPGA is fed wFPGAh a voltage of 3V~3.6V.There is a memory device mounted in Through Hole position for this device.There is a limit to the size of data storage of 100kb bytes.For other related parts, search "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.A termination with different functions in the 8 axis.Using this memory device with a maximum voltage of 3.6V is possible.It is necessary to supply the device with a minimum voltage of 3V.This is a MEMORY CIRCUIT memory chip.Reflow soldering should be done at 250°C maximum.8 pins are located on the board.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.8 pins are set with the part.I would like to mention that this is a memory IC that will be able to work at a 10MHz frequency, so I will mention that.There is a configuration of COMMON for the memory's I/O.In order to obtain the best performance, it is recommended to use a 3.3V power supply.
XC17S10XLPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLPDG8C Applications
There are a lot of Xilinx Inc. XC17S10XLPDG8C applications of configuration proms for FPGAs.
- Cache memory
- servers
- graphics card
- workstations,
- printers
- multimedia computers
- telecommunications
- data buffer
- supercomputers
- networks
