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XC17S10XLPDG8C

Through Hole 100kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S10XL unknown


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC17S10XLPDG8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 740
  • Description: Through Hole 100kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S10XL unknown (Kg)

Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S10XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 100kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Organization 95752X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Memory Density 95752 bit
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status RoHS Compliant

XC17S10XLPDG8C Overview


The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging for external use.Qualified to operate within 0°C~70°C.OTP is the program that allows it to be programmed.FPGA is fed wFPGAh a voltage of 3V~3.6V.There is a memory device mounted in Through Hole position for this device.There is a limit to the size of data storage of 100kb bytes.For other related parts, search "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.A termination with different functions in the 8 axis.Using this memory device with a maximum voltage of 3.6V is possible.It is necessary to supply the device with a minimum voltage of 3V.This is a MEMORY CIRCUIT memory chip.Reflow soldering should be done at 250°C maximum.8 pins are located on the board.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.8 pins are set with the part.I would like to mention that this is a memory IC that will be able to work at a 10MHz frequency, so I will mention that.There is a configuration of COMMON for the memory's I/O.In order to obtain the best performance, it is recommended to use a 3.3V power supply.

XC17S10XLPDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLPDG8C Applications


There are a lot of Xilinx Inc. XC17S10XLPDG8C applications of configuration proms for FPGAs.

  • Cache memory
  • servers
  • graphics card
  • workstations,
  • printers
  • multimedia computers
  • telecommunications
  • data buffer
  • supercomputers
  • networks

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