XC17S10XLVOG8C
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Surface Mount | YES |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S10XL |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 100kb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.005mA |
| Organization | 95752X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Memory Density | 95752 bit |
| I/O Type | COMMON |
| Memory IC Type | MEMORY CIRCUIT |
| Height Seated (Max) | 1.2mm |
| Length | 4.9mm |
| Width | 3.9mm |
| RoHS Status | RoHS Compliant |
XC17S10XLVOG8C Overview
This package makes use of the 8-SOIC (0.154, 3.90mm Width) programming language.Packaging for Tray.As a qualified employee, I can operate within 0°C~70°C.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.Surface Mount is the orientation of this memory device.A data storage size of 100kb is allowed.Try searching "XC17S10XL" for more parts.FPGA reuqires a supply voltage of 3.3V.Different functions are associated with 8 terminations.Using this memory device with a maximum voltage of 3.6V is possible.3V must be the minimum voltage supplied to the device.A MEMORY CIRCUIT memory chip like this is used for data storage.In reflow soldering procedure, the temperature should be controlled to no higher than 260.FPGA has pins on the 8 axis.The memory chip will not operate at a voltage above 0.005mA.Parts come with 8 pins set.When it comes to speed, this is a memory IC that can work at a frequency of 10MHz, which is very fast.In the memory, the I/O configuration has been set to COMMON.A power supply that is rated at 3.3V is recommended for use with this product.
XC17S10XLVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLVOG8C Applications
There are a lot of Xilinx Inc. XC17S10XLVOG8C applications of configuration proms for FPGAs.
- Cache memory
- eDRAM
- telecommunications
- eSRAM
- mainframes
- workstations,
- servers
- DVD disk buffer
- personal computers
- printers
