XC17S150APD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S150A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 1.5Mb |
| Supply Current-Max | 0.005mA |
| Organization | 1040096X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 1 Mb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S150APD8C Overview
An interesting 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.The voltage fed to it is 3V~3.6V.I have mounted this memory device in Through Hole.The size of data storage is limited to 1.5Mb.Try searching "XC17S150A" for more parts.There is a voltage requirement of 3.3V for supplying it with power.8 terminations with different functions.There is a maximum voltage of 3.6V that can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at no higher than 225 degrees.The 8 pins are on the board.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.The memory chip is allowed to operate from a voltage no higher than 0.005mA.Parts include 8 pins.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S150APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S150APD8C Applications
There are a lot of Xilinx Inc. XC17S150APD8C applications of configuration proms for FPGAs.
- telecommunications
- embedded logic
- printers
- networking
- data buffer
- servers
- personal computers
- Camcorders
- main computer memory
- eSRAM
