Parameters |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Number of Pins |
20 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
Published |
1999 |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn85Pb15) |
HTS Code |
8542.32.00.71 |
Technology |
CMOS |
Voltage - Supply |
3V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
225 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC17S150A |
Pin Count |
20 |
Operating Supply Voltage |
3.3V |
Supply Voltage-Max (Vsup) |
3.6V |
Supply Voltage-Min (Vsup) |
3V |
Programmable Type |
OTP |
Memory Size |
1.5Mb |
Supply Current-Max |
0.005mA |
Organization |
1040096X1 |
Output Characteristics |
3-STATE |
Memory Width |
1 |
Density |
1 Mb |
Standby Current-Max |
0.00005A |
Parallel/Serial |
SERIAL |
I/O Type |
COMMON |
Memory IC Type |
CONFIGURATION MEMORY |
Height Seated (Max) |
2.65mm |
Length |
12.8mm |
Width |
7.5mm |
Radiation Hardening |
No |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
XC17S150ASO20I Overview
The package uses a neat 20-SOIC (0.295, 7.50mm Width) interface.Packaging for external use.Qualified to perform a variety of tasks within the -40°C~85°C environment.This device can be programmed using OTP.A voltage of 3V~3.6V is applied to it in order to power it.Surface Mount is the mounting position of this memory device.The size of data storage is limited to 1.5Mb.Search "XC17S150A" for related parts.Supply voltage 3.3V is required.Different functions are associated with 20 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.A CONFIGURATION MEMORY memory chip like this is used for data storage.Reflow soldering should be done at 225°C maximum.FPGA has pins on the 20 axis.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.There is a set of 20 pins included with the part.The I/O configuration of the memory is COMMON.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.
XC17S150ASO20I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S150ASO20I Applications
There are a lot of Xilinx Inc. XC17S150ASO20I applications of configuration proms for FPGAs.
- telecommunications
- supercomputers
- workstations,
- main computer memory
- personal digital assistants
- mainframes
- cell phones
- DVD disk buffer
- eSRAM
- personal computers