XC17S15APD8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S15A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 150kb |
| Supply Current-Max | 0.005mA |
| Organization | 197696X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S15APD8I Overview
FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging for the external use of Tube.A qualified individual who has the ability to operate within -40°C~85°C.With the help of OTP, it can be programmed.FPGA is fed wFPGAh a voltage of 3V~3.6V.Through Hole is the mounting position of this memory device.A data storage size of 150kb is allowed.Other related parts can be found by searching "XC17S15A".The supply voltage of the device must be 3.3V in order to operate correctly.Different functions are associated with 8 terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.3V must be the minimum voltage supplied to the device.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.In reflow soldering procedure, the temperature should be controlled to no higher than 225.The 8 pins are on the board.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.8 pins are set with the part.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S15APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S15APD8I Applications
There are a lot of Xilinx Inc. XC17S15APD8I applications of configuration proms for FPGAs.
- hard disk drive (HDD)
- data buffer
- personal computers
- eSRAM
- main computer memory
- nonvolatile BIOS memory
- Camcorders
- servers
- DVD disk buffer
- workstations,
