XC17S200APDG8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S200A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 2Mb |
| Supply Current-Max | 0.015mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
XC17S200APDG8C Overview
This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external use of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.A maximum of 2Mb bytes of data can be stored.XC17S200A will give you other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.There are 8 pins on it.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate from a voltage no higher than 0.015mA.There is a set of 8 pins that are included with the part.A COMMON configuration is used for the memory's I/O.Prior to the use of the part in a circuit, it is recommended that users apply the 3.3V to the part so that the part will run as safely and reliably as possible.
XC17S200APDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APDG8C Applications
There are a lot of Xilinx Inc. XC17S200APDG8C applications of configuration proms for FPGAs.
- personal digital assistants
- data buffer
- supercomputers
- embedded logic
- eDRAM
- servers
- mainframes
- workstations,
- eSRAM
- Cache memory
