XC17S200APDG8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S200A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 2Mb |
| Supply Current-Max | 0.015mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
XC17S200APDG8I Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Tube external packaging.A qualified individual who has the ability to operate within -40°C~85°C.OTP allows for programmability.The voltage fed to it is 3V~3.6V.There is a memory device mounted in Through Hole position for this device.FPGA is limFPGAed to 2Mb bytes for the size of the data storage.To find other similar parts, search for "XC17S200A".There is a requirement that it is supplied with a voltage of 3.3V.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.The temperature should be kept below 250 in reflow soldering.FPGA is equipped wFPGAh 8 pins.SERIAL-process memory transmits data.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.With the part are included 8 pins.Memory is configured as COMMON for memory's I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S200APDG8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APDG8I Applications
There are a lot of Xilinx Inc. XC17S200APDG8I applications of configuration proms for FPGAs.
- multimedia computers
- embedded logic
- printers
- networks
- eSRAM
- main computer memory
- telecommunications
- DVD disk buffer
- workstations,
- Cache memory
