XC17S20XLPD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S20XL |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 200kb |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.005mA |
| Organization | 179160X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| Memory Density | 179160 bit |
| I/O Type | COMMON |
| Memory IC Type | MEMORY CIRCUIT |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S20XLPD8C Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.The external packaging of Tube is made of Tube plastic.Licensed to operate in 0°C~70°C.This device can be programmed using the OTP language.A voltage of 3V~3.6V is applied to it.The memory device is mounted in Through Hole.The size of data storage is limited to 200kb.Look for "XC17S20XL" for other related parts.3.3V is the required supply voltage.There are different functions that can be applied on the 8 axis when it comes to terminating.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.Using MEMORY CIRCUIT memory chips, this is what you get.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.8 pins are present.A memory chip can operate at a voltage no greater than 0.005mA.There is a set of 8 pins that are included with the part.I think it's important to point out that this is a memory IC that has a 10MHz frequency that can be operated at.The memory's I/O is configured to be COMMON in terms of its configuration.A power supply that is rated at 3.3V is recommended for use with this product.
XC17S20XLPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S20XLPD8C Applications
There are a lot of Xilinx Inc. XC17S20XLPD8C applications of configuration proms for FPGAs.
- workstations,
- networks
- servers
- main computer memory
- personal computers
- cell phones
- data buffer
- multimedia computers
- networking
- telecommunications
