XC17S30APD8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S30 |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 300kb |
| Supply Current-Max | 0.005mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S30APD8I Overview
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Tube external packaging.An individual who is qualified to operate within the -40°C~85°C domain.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.The memory device is mounted in the Through Hole position.A maximum of 300kb bytes of data can be stored.Search "XC17S30" for related parts.3.3V is the voltage it requires as a supply.Various functions can be applied to 8 terminations.3.6V is the maximum voltage that can be used with this memory device.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.A CONFIGURATION MEMORY memory chip like this is used for data storage.If you're reflow soldering, you shouldn't go above 225.8 pins are located on the board.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate at a voltage that is no greater than 0.005mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S30APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S30APD8I Applications
There are a lot of Xilinx Inc. XC17S30APD8I applications of configuration proms for FPGAs.
- printers
- telecommunications
- cell phones
- hard disk drive (HDD)
- multimedia computers
- Cache memory
- graphics card
- servers
- networking
- mainframes
