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XC17S30ASO20C

Surface Mount 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XC17S30ASO20C
  • Package: 20-SOIC (0.295, 7.50mm Width)
  • Datasheet: PDF
  • Stock: 140
  • Description: Surface Mount 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30 (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Number of Pins 20
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 300kb
Supply Current-Max 0.005mA
Organization 336768X1
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 2.65mm
Length 12.8mm
Width 7.5mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S30ASO20C Overview


FPGA uses a neat 20-SOIC (0.295, 7.50mm Width) package.Packaging for external use.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.There is a voltage of 3V~3.6V applied to the device.There is a memory device mounted in Surface Mount.The size of data storage is limited to 300kb.Look for "XC17S30" for other related parts.The supply voltage should be 3.3V.With different functions, 20 terminations can be used.A maximum voltage of 3.6V can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the CONFIGURATION MEMORY memory chip, we can store data.In reflow soldering procedure, the temperature should be controlled to no higher than 225.In this case, it has 20 pins.Data is transmitted in this memory using a SERIAL process.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts include 20 pins.A COMMON configuration is used for the memory's I/O.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.

XC17S30ASO20C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S30ASO20C Applications


There are a lot of Xilinx Inc. XC17S30ASO20C applications of configuration proms for FPGAs.

  • telecommunications
  • data buffer
  • hard disk drive (HDD)
  • networking
  • Camcorders
  • Cache memory
  • servers
  • workstations,
  • main computer memory
  • personal digital assistants

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