XC17S30ASO20C
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Number of Pins | 20 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| HTS Code | 8542.32.00.71 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S30 |
| Pin Count | 20 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 300kb |
| Supply Current-Max | 0.005mA |
| Organization | 336768X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 512 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 2.65mm |
| Length | 12.8mm |
| Width | 7.5mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S30ASO20C Overview
FPGA uses a neat 20-SOIC (0.295, 7.50mm Width) package.Packaging for external use.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.There is a voltage of 3V~3.6V applied to the device.There is a memory device mounted in Surface Mount.The size of data storage is limited to 300kb.Look for "XC17S30" for other related parts.The supply voltage should be 3.3V.With different functions, 20 terminations can be used.A maximum voltage of 3.6V can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the CONFIGURATION MEMORY memory chip, we can store data.In reflow soldering procedure, the temperature should be controlled to no higher than 225.In this case, it has 20 pins.Data is transmitted in this memory using a SERIAL process.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts include 20 pins.A COMMON configuration is used for the memory's I/O.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.
XC17S30ASO20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S30ASO20C Applications
There are a lot of Xilinx Inc. XC17S30ASO20C applications of configuration proms for FPGAs.
- telecommunications
- data buffer
- hard disk drive (HDD)
- networking
- Camcorders
- Cache memory
- servers
- workstations,
- main computer memory
- personal digital assistants
