XC17S30XLPDG8C
| Parameters | |
|---|---|
| Power Supplies | 3.3V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Interface | Serial |
| Memory Size | 300kb |
| Memory Type | PROM |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 10MHz |
| Supply Current-Max | 0.005mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.00005A |
| I/O Type | COMMON |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Termination | Through Hole |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 250 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S30XL |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
XC17S30XLPDG8C Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging for Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.OTP allows for programmability.With a voltage of 3V~3.6V, it is powered.Mounted in Through Hole is this memory device.The size of data storage is limited to 300kb.Look for "XC17S30XL" for other related parts.Supply voltage 3.3V is required.Different functions are associated with 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.It is necessary to supply the device with a minimum voltage of 3V.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.Pins on it are 8-shaped.The memory chip is allowed to operate from a voltage no higher than 0.005mA.The part comes with a set of 8 pins.Speaking of speed, this is a memory IC that can work at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended to use a 3.3V power supply.The PROM memory is also referred to as the X memory.
XC17S30XLPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory
XC17S30XLPDG8C Applications
There are a lot of Xilinx Inc. XC17S30XLPDG8C applications of configuration proms for FPGAs.
- embedded logic
- graphics card
- personal digital assistants
- personal computers
- networking
- mainframes
- main computer memory
- nonvolatile BIOS memory
- data buffer
- multimedia computers
