XC17S50ASO20I
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Number of Pins | 20 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| HTS Code | 8542.32.00.71 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S50A |
| Pin Count | 20 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 500kb |
| Supply Current-Max | 0.015mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 1 Mb |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 2.65mm |
| Length | 12.8mm |
| Width | 7.5mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S50ASO20I Overview
This package makes use of the 20-SOIC (0.295, 7.50mm Width) programming language.Packaging for the external environment.A qualified individual to operate within -40°C~85°C is required.Using the OTP axis, it can be programmed to do whatever you want.There is a voltage of 3V~3.6V applied to the device.Mounted in Surface Mount is this memory device.There is a limit to the size of data storage of 500kb bytes.XC17S50A will give you other related parts.3.3V is the required supply voltage.A termination with different functions in the 20 axis.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.This is a CONFIGURATION MEMORY memory chip.The temperature should be kept below 225 in reflow soldering.FPGA is equipped wFPGAh 20 pins.This memory transmit data in the SERIAL process way.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.Parts include 20 pins.The memory's I/O is configured as COMMON.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17S50ASO20I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50ASO20I Applications
There are a lot of Xilinx Inc. XC17S50ASO20I applications of configuration proms for FPGAs.
- personal computers
- Camcorders
- printers
- workstations,
- hard disk drive (HDD)
- DVD disk buffer
- mainframes
- networking
- graphics card
- embedded logic
