XC17S50AVOG8C
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Surface Mount | YES |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S50A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 500kb |
| Supply Current-Max | 0.015mA |
| Organization | 559200X1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 1 Mb |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 1.2mm |
| Length | 4.9mm |
| Width | 3.9mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
XC17S50AVOG8C Overview
An interesting 8-SOIC (0.154, 3.90mm Width) package is used.External packaging for the Tray series.In the state of 0°C~70°C, licensed to work.With the help of OTP, it can be programmed.A voltage of 3V~3.6V is applied to it.Mounted in Surface Mount is this memory device.Data storage is limited to 500kb bytes.You can search "XC17S50A" for other related parts.There is a voltage requirement of 3.3V for supplying it with power.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.Using CONFIGURATION MEMORY memory chips, this is what you get.FPGA is recommended that the reflow soldering temperature be maintained at no more than 260 during the process.In this case, it has 8 pins.This memory transmit data in the SERIAL process way.The memory chip will not operate at a voltage above 0.015mA.There is a set of 8 pins included with the part.This memory has a COMMON configuration for its I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S50AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50AVOG8C Applications
There are a lot of Xilinx Inc. XC17S50AVOG8C applications of configuration proms for FPGAs.
- embedded logic
- eDRAM
- servers
- multimedia computers
- cell phones
- telecommunications
- main computer memory
- printers
- networking
- graphics card
