Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Number of Pins |
20 |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
Published |
1999 |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn85Pb15) |
Subcategory |
Flash Memories |
Technology |
CMOS |
Voltage - Supply |
3V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
225 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC18V512 |
Pin Count |
20 |
Operating Supply Voltage |
3.3V |
Supply Voltage-Max (Vsup) |
3.6V |
Supply Voltage-Min (Vsup) |
3V |
Programmable Type |
In System Programmable |
Clock Frequency |
33MHz |
Supply Current-Max |
0.025mA |
Organization |
64KX8 |
Memory Width |
8 |
Density |
512 kb |
Standby Current-Max |
0.01A |
Access Time (Max) |
15 ns |
Parallel/Serial |
PARALLEL/SERIAL |
Memory IC Type |
CONFIGURATION MEMORY |
Data Retention Time-Min |
20 |
Height Seated (Max) |
2.6416mm |
Length |
12.827mm |
Width |
7.5184mm |
Radiation Hardening |
No |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
XC18V512SO20C Overview
There is a neat 20-SOIC (0.295, 7.50mm Width) package that is used in this program.Packaging for external use.A qualified individual who has the ability to operate within 0°C~70°C.The In System Programmable programming language can be used to program it.FPGA is fed wFPGAh a voltage of 3V~3.6V.Surface Mount is the orientation of this memory device.You can search "XC18V512" for other related parts.3.3V is the required supply voltage.FPGA is possible to connect different functions on the 20 axis at different terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.FPGA is equipped wFPGAh 20 pins.A PARALLEL/SERIAL-processing method is used to transfer data through this memory.For the memory chip to operate, it requires a voltage not exceeding 0.025mA.With the part are included 20 pins.Using a 33MHz frequency, this memory IC can work at high speeds.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.In specific, it can be described as a form of Flash Memories.
XC18V512SO20C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V512SO20C Applications
There are a lot of Xilinx Inc. XC18V512SO20C applications of configuration proms for FPGAs.
- supercomputers
- personal digital assistants
- printers
- workstations,
- main computer memory
- hard disk drive (HDD)
- eDRAM
- Camcorders
- networks
- Cache memory