XC18V512SOG20C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Number of Pins | 20 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 1999 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 20 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Subcategory | Flash Memories |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC18V512 |
| Pin Count | 20 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | In System Programmable |
| Clock Frequency | 33MHz |
| Supply Current-Max | 0.025mA |
| Organization | 64KX8 |
| Memory Width | 8 |
| Density | 512 kb |
| Standby Current-Max | 0.01A |
| Access Time (Max) | 15 ns |
| Parallel/Serial | PARALLEL/SERIAL |
| Memory IC Type | CONFIGURATION MEMORY |
| Data Retention Time-Min | 20 |
| Height Seated (Max) | 2.6416mm |
| Length | 12.827mm |
| Width | 7.5184mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
XC18V512SOG20C Overview
A neat 20-SOIC (0.295, 7.50mm Width) package is used.External packaging of type Tray.0°C~70°C-qualified.This device can be programmed using In System Programmable.The voltage fed to it is 3V~3.6V.FPGA is mounted in Surface Mount.Look for "XC18V512" for other related parts.Supply voltage 3.3V is required.20 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.FPGA has pins on the 20 axis.Through PARALLEL/SERIAL-processing, data is transmitted from this memory to the CPU.A memory chip can operate at a voltage no greater than 0.025mA.Parts include 20 pins.Using a 33MHz frequency, this memory IC can work at high speeds.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.In specific, it can be described as a form of Flash Memories.
XC18V512SOG20C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V512SOG20C Applications
There are a lot of Xilinx Inc. XC18V512SOG20C applications of configuration proms for FPGAs.
- servers
- eDRAM
- data buffer
- networking
- personal digital assistants
- workstations,
- cell phones
- multimedia computers
- eSRAM
- mainframes
