XC3S1000-4FGG456I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 456-BBGA |
| Number of Pins | 456 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Series | Spartan®-3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 456 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1000 |
| Pin Count | 456 |
| Number of Outputs | 333 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 333 |
| RAM Size | 54kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 17280 |
| Total RAM Bits | 442368 |
| Number of Gates | 1000000 |
| Number of LABs/CLBs | 1920 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Height Seated (Max) | 2.6mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | ROHS3 Compliant |
XC3S1000-4FGG456I Overview
In the package 456-BBGA, this product is provided. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 333 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 17280 logic elements/cells are required. Fpga chips is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGAs includes this part. Surface Mount-connectors can be used to attach this FPGA module to the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. During the installation of this device, 333 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 456 terminations on each end. The RAM bits that this device offer is 442368. XC3S1000 is the base part number that can be used to identify related parts. This FPGA module has a RAM si54kBe of 54kB that is sufficient to make sure that the program is able to run normally. 456 pins are designed into the device. 1920 LABs/CLBs are integrated into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. This is a battery operated device that operates on 1.21.2/3.32.5V. There are 1000000 gates in its basic building block. The device has a total of 456 pins on fpga semiconductor. It usually uses a 630MHz crystal.
XC3S1000-4FGG456I Features
333 I/Os
Up to 442368 RAM bits
456 LABs/CLBs
XC3S1000-4FGG456I Applications
There are a lot of Xilinx Inc. XC3S1000-4FGG456I FPGAs applications.
- Enterprise networking
- Consumer Electronics
- Voice recognition
- Wired Communications
- Device controllers
- Audio
- Electronic Warfare
- Filtering and communication encoding
- Computer hardware emulation
- Automotive Applications
