XC3S100E-4VQG100C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 100-TQFP |
| Number of Pins | 100 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | Spartan®-3E |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 100 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S100E |
| Pin Count | 100 |
| Number of Outputs | 59 |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 66 |
| RAM Size | 9kB |
| Clock Frequency | 572MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 2160 |
| Total RAM Bits | 73728 |
| Number of Gates | 100000 |
| Number of LABs/CLBs | 240 |
| Speed Grade | 4 |
| Number of Registers | 1920 |
| Combinatorial Delay of a CLB-Max | 0.76 ns |
| Number of CLBs | 240 |
| Height | 1mm |
| Length | 14mm |
| Width | 14mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
XC3S100E-4VQG100C Overview
In the 100-TQFP package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 66 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 2160 logic elements or cells. 1.2V volts power it. An FPGA part from the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan?-3E series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. This device is equipped with 59 separate outputs, which makes it a very versatile device. Using the Tray layout, this FPGA model can be contained in a very small amount of space. As a whole, it has 100 terminations. This device has 73728 RAM bits, which is the number of RAM bits that this device offers. In order to find related parts, you can use its base part number XC3S100E. The RAM si9kBe of this FPGA module reaches 9kB so as to guarantee the normal operation of the program during operation. In order to make it work, 100 pins have been designed. 240 LABs/CLBs are configured on this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. The building block that forms the basis of the system contains 100000 gates. Featuring 100 pins in total, it is a versatile device. Typically, it uses a crystal oscillating at 572MHz in order to operate. Fpga semiconductor is important to note that the data is stored and transferred in 1920 different registers. A CLB is a basic module that determines the architecture of a system.
XC3S100E-4VQG100C Features
66 I/Os
Up to 73728 RAM bits
100 LABs/CLBs
1920 registers
XC3S100E-4VQG100C Applications
There are a lot of Xilinx Inc. XC3S100E-4VQG100C FPGAs applications.
- Digital signal processing
- Electronic Warfare
- Software-defined radio
- Aircraft navigation
- Industrial Ethernet
- Wireless Communications
- Data center hardware accelerators
- Development Boards and Shields for Microcontrollers
- Random logic
- Automotive Applications
