XC3S1400A-5FGG676C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3A |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1400A |
| Pin Count | 676 |
| Number of Outputs | 408 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Number of I/O | 502 |
| RAM Size | 72kB |
| Clock Frequency | 770MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 25344 |
| Total RAM Bits | 589824 |
| Number of Gates | 1400000 |
| Number of LABs/CLBs | 2816 |
| Speed Grade | 5 |
| Combinatorial Delay of a CLB-Max | 0.62 ns |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
XC3S1400A-5FGG676C Overview
In the 676-BGA package, you will find fpga chips. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. The I/Os are designed to facilitate a more coherent transfer of data. In order to construct a fundamental building block, 25344 logic elements/cells are required. Supply voltage is 1.2V volts. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. The Spartan?-3A Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. During the installation of this device, 408 outputs were incorporated. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, the terminations of this piece are 676. This device is equipped with 589824 RAM bits in terms of its RAM si589824e. Parts related to this part can be found using its base part number XC3S1400A. The FPGA module's RAM si72kBe reaches 72kB in order to ensure that the program operates in a normal manner. The device is designed with 676 pins in total. An array of 2816 LABs/CLBs is built into the FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Designers can fully utilize its flexibility with 1.2V supply voltage. The building block that forms the basis of the system contains 1400000 gates. This device has a pin count of 676 in fpga semiconductor. Normally, fpga semiconductor uses an oscillator, which oscillates at 770MHz, to create the signal.
XC3S1400A-5FGG676C Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
XC3S1400A-5FGG676C Applications
There are a lot of Xilinx Inc. XC3S1400A-5FGG676C FPGAs applications.
- Cryptography
- Wireless Communications
- Software-defined radios
- High Performance Computing
- Automotive Applications
- Defense Applications
- ASIC prototyping
- Automotive driver's assistance
- Ecosystem
- Telecommunication
