XC3S1400AN-4FGG676C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Termination | SMD/SMT |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 250MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1400AN |
| Pin Count | 676 |
| Number of Outputs | 408 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 502 |
| RAM Size | 72kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 25344 |
| Total RAM Bits | 589824 |
| Number of Gates | 1400000 |
| Number of LABs/CLBs | 2816 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Length | 27mm |
| Width | 27mm |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
XC3S1400AN-4FGG676C Overview
In the package 676-BGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 502 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 25344 logic elements/cells are required. In order to operate fpga chips, a voltage supply of 1.2V volts is required. The Field Programmable Gate Arrays family of FPGAs includes this part. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. This is a type of FPGA that is part of the Spartan?-3AN series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In this device, 408 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, it has a total of 676 terminations. Fpga electronics is worth mentioning that this device provides 589824 bfpga electronics s of RAM. For related parts, use its base part number XC3S1400AN. Fpga electronics is important that this FPGA module has a RAM si72kBe of 72kB in order to ensure that the program will run normally. The device is designed with 676 pins in total. A total of 2816 LABs/CLBs are included in this FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Power is provided by a 1.21.2/3.33.3V battery that is included with the device. There are 1400000 gates that make up its basic building block. As far as the pin count is concerned, it has 676 pins. A frequency of 250MHz provides high efficiency.
XC3S1400AN-4FGG676C Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
Operating from a frequency of 250MHz
XC3S1400AN-4FGG676C Applications
There are a lot of Xilinx Inc. XC3S1400AN-4FGG676C FPGAs applications.
- Industrial,Medical and Scientific Instruments
- Medical Applications
- Industrial Ethernet
- Computer hardware emulation
- Scientific Instruments
- Server Applications
- Wireless Communications
- Automotive driver's assistance
- Military DSP
- Aerospace and Defense
