XC3S1400AN-4FGG676I
| Parameters | |
|---|---|
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1400AN |
| Pin Count | 676 |
| Number of Outputs | 408 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 502 |
| RAM Size | 72kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 25344 |
| Total RAM Bits | 589824 |
| Number of Gates | 1400000 |
| Number of LABs/CLBs | 2816 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Length | 27mm |
| Width | 27mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
XC3S1400AN-4FGG676I Overview
There are two packages that contain fpga chips: 676-BGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. 502 I/Os are available for transferring data more efficiently. There are 25344 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. There are many types of FPGAs in the Spartan?-3AN series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In this device, there are 408 outputs that can be used. This FPGA model is contained in Tray for space saving. In total, there are a total of 676 terminations on fpga chips. This device is equipped with 589824 RAM bits in terms of its RAM si589824e. Parts related to this part can be found using its base part number XC3S1400AN. During the configuration of this FPGA module, the RAM si72kBe reaches 72kB to ensure that the program runs normally. There are 676 pins on this device. The FPGA is built as an array of 2816 latches or CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.33.3V power supply. There are 1400000 gates that make up its basic building block. With a total of 676 pins, it is equipped with a high level of security. To achieve high efficiency, it runs at a frequency of 667MHz.
XC3S1400AN-4FGG676I Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
Operating from a frequency of 667MHz
XC3S1400AN-4FGG676I Applications
There are a lot of Xilinx Inc. XC3S1400AN-4FGG676I FPGAs applications.
- Integrating multiple SPLDs
- Aerospace and Defense
- Automation
- Broadcast
- Aircraft navigation
- Data center hardware accelerators
- Computer hardware emulation
- Automotive advanced driver assistance systems (ADAS)
- Software-defined radios
- Artificial intelligence (AI)
