XC3S1600E-4FGG320C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 320-BGA |
| Number of Pins | 320 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3E |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 320 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1600E |
| Pin Count | 320 |
| Number of Outputs | 194 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 250 |
| RAM Size | 81kB |
| Clock Frequency | 572MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 33192 |
| Total RAM Bits | 663552 |
| Number of Gates | 1600000 |
| Number of LABs/CLBs | 3688 |
| Speed Grade | 4 |
| Number of Registers | 29504 |
| Combinatorial Delay of a CLB-Max | 0.76 ns |
| Height | 1.4mm |
| Length | 19mm |
| Width | 19mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
XC3S1600E-4FGG320C Overview
In the 320-BGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 250 I/Os for better data transfer. There are 33192 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. There is a Field Programmable Gate Arrays family component in this FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. The supply voltage of the device is 1.14V~1.26V , at which it runs. As part of the Spartan?-3E series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. In order to make this device as versatile as possible, there are 194 different outputs included. There is an FPGA model contained in Tray in order to conserve space. In total, the terminations of this piece are 320. A device like this one offers 663552 RAM bits, which is a considerable amount of memory. If you are looking for related parts, you can use the base part number XC3S1600E as a starting point. During the configuration of this FPGA module, the RAM si81kBe reaches 81kB to ensure that the program runs normally. The device has 320 pins which are included in the design. 3688 LABs/CLBs are integrated into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. It is powered by a 1.21.2/3.32.5V battery, which can be purchased separately. A basic building block for this type of building block consists of 1600000 gates. As far as the pin count is concerned, it has 320 pins. Typically, fpga semiconductor uses a crystal oscillating at 572MHz . To store and transfer data, there are 29504 registers that are used.
XC3S1600E-4FGG320C Features
250 I/Os
Up to 663552 RAM bits
320 LABs/CLBs
29504 registers
XC3S1600E-4FGG320C Applications
There are a lot of Xilinx Inc. XC3S1600E-4FGG320C FPGAs applications.
- Distributed Monetary Systems
- Defense Applications
- Random logic
- Medical ultrasounds
- Software-defined radio
- DO-254
- Software-defined radios
- Automotive Applications
- Audio
- Data Mining
