XC3S1600E-4FGG484I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3E |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1600E |
| Pin Count | 484 |
| Number of Outputs | 294 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 376 |
| RAM Size | 81kB |
| Clock Frequency | 572MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 33192 |
| Total RAM Bits | 663552 |
| Number of Gates | 1600000 |
| Number of LABs/CLBs | 3688 |
| Speed Grade | 4 |
| Number of Registers | 29504 |
| Combinatorial Delay of a CLB-Max | 0.76 ns |
| Height Seated (Max) | 2.6mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | ROHS3 Compliant |
XC3S1600E-4FGG484I Overview
The package that contains this software is called 484-BBGA. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 376 I/Os help it transfer data more efficiently. Logic blocks consist of 33192 logic elements/cells. It is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order for it to operate, the supply voltage must be 1.14V~1.26V . This is a type of FPGA that is part of the Spartan?-3E series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. In this device, there are 294 outputs that can be used. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. 484 terminations are present in total. There are 663552 RAM bits that are available with this device. In order to find related parts, you can use its base part number XC3S1600E. The RAM si81kBe of this FPGA module reaches 81kB so as to guarantee the normal operation of the program during operation. In this case, there are 484 pins on the board. 3688 LABs/CLBs are integrated into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Designers can fully utilize its flexibility with 1.2V supply voltage. The device runs on a 1.21.2/3.32.5V battery and requires no additional power supply to operate. 1600000 gates make up the basic block of its construction. This device has a pin count of 484 in fpga semiconductor. Fpga semiconductor typically uses a crystal oscillating at 572MHz. A total of 29504 registers are used for storing and transferring data between them.
XC3S1600E-4FGG484I Features
376 I/Os
Up to 663552 RAM bits
484 LABs/CLBs
29504 registers
XC3S1600E-4FGG484I Applications
There are a lot of Xilinx Inc. XC3S1600E-4FGG484I FPGAs applications.
- Industrial IoT
- Embedded Vision
- Voice recognition
- Artificial intelligence (AI)
- Military Temperature
- Medical Applications
- Automotive Applications
- Military DSP
- Server Applications
- Video & Image Processing
