XC3S1600E-5FGG400C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 400-BGA |
| Number of Pins | 400 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Spartan®-3E |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 400 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S1600E |
| Pin Count | 400 |
| Number of Outputs | 132 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Number of I/O | 304 |
| RAM Size | 81kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 33192 |
| Total RAM Bits | 663552 |
| Number of Gates | 1600000 |
| Number of LABs/CLBs | 3688 |
| Speed Grade | 5 |
| Number of Registers | 29504 |
| Combinatorial Delay of a CLB-Max | 0.66 ns |
| Height Seated (Max) | 2.43mm |
| Length | 21mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |
XC3S1600E-5FGG400C Overview
A 400-BGA package contains it, and it is available for download. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 304 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 33192 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 1.14V~1.26V . As part of the Spartan?-3E series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~85°C TJ when operating. This device is equipped with 132 separate outputs, which makes it a very versatile device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 400 terminations on each end. This device is equipped with 663552 RAM bits in terms of its RAM si663552e. Related parts can be found by using its base part number XC3S1600E. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. It has a total of 400 pins that are designed for it. 3688 LABs and CLBs are built into this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 1600000 gates. With a total of 400 pins, it is equipped with a high level of security. The data is stored and transferred using 29504 registers that are used for this purpose.
XC3S1600E-5FGG400C Features
304 I/Os
Up to 663552 RAM bits
400 LABs/CLBs
29504 registers
XC3S1600E-5FGG400C Applications
There are a lot of Xilinx Inc. XC3S1600E-5FGG400C FPGAs applications.
- Automotive
- Wired Communications
- DO-254
- Aerospace and Defense
- Bioinformatics
- Automotive Applications
- Filtering and communication encoding
- Development Boards and Shields for Microcontrollers
- Integrating multiple SPLDs
- Security systems
