XC3S200-4FT256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Standard |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Bulk |
| Published | 2006 |
| Series | Spartan®-3 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 256 |
| Number of Outputs | 173 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 173 |
| RAM Size | 27kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4320 |
| Total RAM Bits | 221184 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 480 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Number of CLBs | 480 |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | Non-RoHS Compliant |
XC3S200-4FT256I Overview
This package is included in the 256-LBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 173 I/Os allow data to be transferred in a more coherent manner. There are 4320 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. FPGA parts like this belong to the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. With this device, you will be able to make use of 173 outputs. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. 256 terminations are present in total. The RAM bits that this device offer is 221184. During the configuration of this FPGA module, the RAM si27kBe reaches 27kB to ensure that the program runs normally. In order to make it work, 256 pins have been designed. A total of 480 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Standard, then it may be able to perform fantastically according to its specifications. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 1.21.2/3.32.5V. The building block that forms the basis of the system contains 200000 gates. Featuring 256 pins in total, it is a versatile device. It usually uses a 630MHz crystal. For its architecture, 480 CLB modules are used.
XC3S200-4FT256I Features
173 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
XC3S200-4FT256I Applications
There are a lot of Xilinx Inc. XC3S200-4FT256I FPGAs applications.
- Aircraft navigation
- Server Applications
- Automotive Applications
- Industrial,Medical and Scientific Instruments
- Filtering and communication encoding
- ASIC prototyping
- Secure Communication
- OpenCL
- Computer hardware emulation
- Data center search engines
