XC3S200-4FTG256C
| Parameters | |
|---|---|
| Number of Gates | 200000 |
| Number of LABs/CLBs | 480 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Number of CLBs | 480 |
| Height | 1mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Series | Spartan®-3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200 |
| Pin Count | 256 |
| Number of Outputs | 173 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 173 |
| RAM Size | 27kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4320 |
| Total RAM Bits | 221184 |
XC3S200-4FTG256C Overview
Fpga chips is supplied in the 256-LBGA package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. There are 173 I/Os for better data transfer. To form a fundamental building block, there are 4320 logic elements/cells. An electrical supply voltage of 1.2V powers it. Field Programmable Gate Arrays family FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 1.14V~1.26V . This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In order to make this device as versatile as possible, there are 173 different outputs included. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is designed wFpga chipsh 256 terminations. Having a RAM bit size of 221184 means that this device will offer you a lot of memory. Related parts can be found by using its base part number XC3S200. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. It has a total of 256 pins that are designed for it. 480 LABs/CLBs are integrated into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The device runs on a 1.21.2/3.32.5V battery and requires no additional power supply to operate. There are 200000 gates in its basic building block. A total of 256 pins are included in this device. Normally, fpga semiconductor uses an oscillator, which oscillates at 630MHz, to create the signal. There are 480 CLBs that make up the architecture of the system.
XC3S200-4FTG256C Features
173 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
XC3S200-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S200-4FTG256C FPGAs applications.
- Scientific Instruments
- Wired Communications
- Data Mining
- Automation
- Industrial Ethernet
- Audio
- Medical Applications
- Wireless Communications
- Data center hardware accelerators
- Defense Applications
