XC3S200-4FTG256I
| Parameters | |
|---|---|
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Series | Spartan®-3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200 |
| Pin Count | 256 |
| Number of Outputs | 173 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 173 |
| RAM Size | 27kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4320 |
| Total RAM Bits | 221184 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 480 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Number of CLBs | 480 |
XC3S200-4FTG256I Overview
A 256-LBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. There are 4320 logic elements/cells to form a fundamental building block. An electrical supply voltage of 1.2V powers it. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.14V~1.26V . The Spartan?-3 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. A device such as this one has 173 outputs built into it. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that are offered by this fpga chips are 221184. Its base part number XC3S200 can be used to find parts that are related to it. It is crucial that the RAM si27kBe of this FPGA module reaches 27kB so that the program can run normally. It has a total of 256 pins that are designed for it. 480 LABs/CLBs are integrated into this FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. The device runs on a 1.21.2/3.32.5V battery and requires no additional power supply to operate. Its basic building block contains 200000 gates. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. Normally, fpga semiconductor uses an oscillator, which oscillates at 630MHz, to create the signal. In order to make the architecture work, 480 CLBs are used.
XC3S200-4FTG256I Features
173 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
XC3S200-4FTG256I Applications
There are a lot of Xilinx Inc. XC3S200-4FTG256I FPGAs applications.
- Wireless Communications
- DO-254
- Industrial Ethernet
- Solar Energy
- Automation
- Industrial,Medical and Scientific Instruments
- Broadcast
- Bioinformatics
- Medical ultrasounds
- High Performance Computing
