XC3S2000-4FGG676C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Number of Pins | 676 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Spartan®-3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S2000 |
| Pin Count | 676 |
| Number of Outputs | 489 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 489 |
| RAM Size | 90kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of Gates | 2000000 |
| Number of LABs/CLBs | 5120 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
XC3S2000-4FGG676C Overview
The package that contains this software is called 676-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. 489 I/Os are available for transferring data more efficiently. A fundamental building block contains 46080 logic elements or cells. Power is provided by a 1.2V-volt supply. A Field Programmable Gate Arrays-series FPGA part. This FPGA module can be attached to the development board with a Surface Mount. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. FPGAs belonging to the Spartan?-3 series are a type of FPGA that belong to the Spartan?-3 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. A device such as this one has 489 outputs built into it. A model of this FPGA is contained in Tray for the purpose of saving space. In total, the terminations of this piece are 676. Having a RAM bit size of 737280 means that this device will offer you a lot of memory. You can find related parts by using the part number XC3S2000, which is its base part number. There is a maximum RAM si90kBe of 90kB on this FPGA module, which is necessary to ensure the normal operation of the program. In this case, there are 676 pins on the board. This FPGA is built as an array of 5120 LABs/CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. As a basic building block, fpga semiconductor consists of 2000000 gates. There are a total of 676 pins on this device. A crystal oscillating at 630MHz is one of the most common components of this device.
XC3S2000-4FGG676C Features
489 I/Os
Up to 737280 RAM bits
676 LABs/CLBs
XC3S2000-4FGG676C Applications
There are a lot of Xilinx Inc. XC3S2000-4FGG676C FPGAs applications.
- Broadcast
- Medical imaging
- Integrating multiple SPLDs
- Enterprise networking
- Audio
- Space Applications
- Server Applications
- Telecommunication
- Solar Energy
- Bioinformatics
