XC3S200AN-4FT256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3AN |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200AN |
| Pin Count | 256 |
| Number of Outputs | 160 |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 195 |
| RAM Size | 36kB |
| Clock Frequency | 667MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 448 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Number of CLBs | 448 |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
XC3S200AN-4FT256C Overview
The package that contains this software is called 256-LBGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 4032 logic elements/cells. 1.2V volts power it. Field Programmable Gate Arrays family FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Spartan?-3AN seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 160 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. Total terminations are 256. Having a RAM bit size of 294912 means that this device will offer you a lot of memory. In order to find related parts, use the part number XC3S200AN as a base. It is crucial that the RAM si36kBe of this FPGA module reaches 36kB so that the program can run normally. The device has 256 pins which are included in the design. An array of 448 LABs/CLBs is built into the FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. An external power supply of 1.21.2/3.33.3V is required to power the device. The building block that forms the basis of the system contains 200000 gates. There are a total of 256 pins on this device. Most of the time, it uses a crystal oscillating at 667MHz to generate the signal. 448 CLBs are basic modules used for its architecture.
XC3S200AN-4FT256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
XC3S200AN-4FT256C Applications
There are a lot of Xilinx Inc. XC3S200AN-4FT256C FPGAs applications.
- Medical Electronics
- Broadcast
- Industrial,Medical and Scientific Instruments
- Automotive Applications
- Aerospace and Defense
- Device controllers
- Scientific Instruments
- Automotive advanced driver assistance systems (ADAS)
- Solar Energy
- Random logic
