XC3S200AN-4FTG256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Frequency | 250MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200AN |
| Pin Count | 256 |
| Number of Outputs | 160 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 195 |
| RAM Size | 36kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 448 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Number of CLBs | 448 |
| Height | 1mm |
| Length | 17mm |
| Width | 17mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
XC3S200AN-4FTG256C Overview
The package that contains this software is called 256-LBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 195 I/Os for better data transfer. A fundamental building block is made up of 4032 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The Spartan?-3AN Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. The device has 160 outputs that are integrated into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Total terminations are 256. There are 294912 RAM bits that are available with this device. Related parts can be found by using its base part number XC3S200AN. For the program to work properly, the RAM si36kBe of this FPGA module must reach 36kB GB in order to ensure normal operation. Fpga electronics is designed wfpga electronics h 256 pins. The FPGA is built as an array of 448 latches or CLBs. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. Power is provided by a 1.21.2/3.33.3V battery that is included with the device. 200000 gates make up the basic block of its construction. In addition to this, it has 256 pins. 448 CLBs are basic modules used for its architecture. Powered by a 250MHz-frequency motor, it delivers high efficiency.
XC3S200AN-4FTG256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
Operating from a frequency of 250MHz
XC3S200AN-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S200AN-4FTG256C FPGAs applications.
- Industrial Ethernet
- Distributed Monetary Systems
- DO-254
- Computer hardware emulation
- Space Applications
- Artificial intelligence (AI)
- Security systems
- Embedded Vision
- Medical ultrasounds
- Radar and Sensors
