Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-LBGA |
Number of Pins |
256 |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2007 |
Series |
Spartan®-3AN |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XC3S200AN |
Pin Count |
256 |
Number of Outputs |
160 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Power Supplies |
1.21.2/3.33.3V |
Number of I/O |
195 |
RAM Size |
36kB |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
4032 |
Total RAM Bits |
294912 |
Number of Gates |
200000 |
Number of LABs/CLBs |
448 |
Speed Grade |
4 |
Combinatorial Delay of a CLB-Max |
0.71 ns |
Number of CLBs |
448 |
Height Seated (Max) |
1.55mm |
Length |
17mm |
Width |
17mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
XC3S200AN-4FTG256I Overview
The package that contains this software is called 256-LBGA. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The device has 195 I/O ports for more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.14V~1.26V battery. FPGAs belonging to the Spartan?-3AN series are a type of FPGA that belong to the Spartan?-3AN series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. There are 160 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that this device offer is 294912. You can find related parts by using the part number XC3S200AN, which is its base part number. For the program to work properly, the RAM si36kBe of this FPGA module must reach 36kB GB in order to ensure normal operation. Fpga electronics is designed wfpga electronics h 256 pins. Fpga electronics contains 448 LABs/CLBs in an array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Power is supplied to the device by a 1.21.2/3.33.3V battery. There are 200000 gates that make up its basic building block. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. There are 448 CLBs that make up the architecture of the system. To achieve high efficiency, it runs at a frequency of 667MHz.
XC3S200AN-4FTG256I Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
Operating from a frequency of 667MHz
XC3S200AN-4FTG256I Applications
There are a lot of Xilinx Inc. XC3S200AN-4FTG256I FPGAs applications.
- Space Applications
- ADAS
- Automotive advanced driver assistance systems (ADAS)
- Aerospace and Defense
- Video & Image Processing
- Server Applications
- Industrial Ethernet
- Cryptography
- Image processing
- ASIC prototyping