XC3S200AN-5FT256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3AN |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200AN |
| Pin Count | 256 |
| Number of Outputs | 160 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 195 |
| RAM Size | 36kB |
| Clock Frequency | 770MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 448 |
| Speed Grade | 5 |
| Combinatorial Delay of a CLB-Max | 0.62 ns |
| Number of CLBs | 448 |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | Non-RoHS Compliant |
XC3S200AN-5FT256C Overview
As part of the 256-LBGA package, it is included. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. This device features 195 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 4032 logic elements/cells. Power is provided by a 1.2V-volt supply. A Field Programmable Gate Arrays-series FPGA part. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. An FPGA belonging to the Spartan?-3AN series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. This device is equipped with 160 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. Total terminations are 256. A device like this one offers 294912 RAM bits, which is a considerable amount of memory. XC3S200AN is the base part number that can be used to identify related parts. Fpga electronics is important that this FPGA module has a RAM si36kBe of 36kB in order to ensure that the program will run normally. This cable has 256 pins and is designed to connect to a computer. 448 LABs and CLBs are built into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. There is a 1.21.2/3.33.3V power supply that is required to operate it. A basic building block for this type of building block consists of 200000 gates. Featuring 256 pins in total, it is a versatile device. It usually uses a crystal oscillating at a frequency of 770MHz in order to do its work. For its architecture, 448 CLB modules are used.
XC3S200AN-5FT256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
XC3S200AN-5FT256C Applications
There are a lot of Xilinx Inc. XC3S200AN-5FT256C FPGAs applications.
- Server Applications
- Wireless Communications
- Electronic Warfare
- Digital signal processing
- Artificial intelligence (AI)
- Development Boards and Shields for Microcontrollers
- Scientific Instruments
- Software-defined radio
- Military Temperature
- Enterprise networking
