XC3S200AN-5FTG256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S200AN |
| Pin Count | 256 |
| Number of Outputs | 160 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 195 |
| RAM Size | 36kB |
| Clock Frequency | 770MHz |
| Propagation Delay | 4.36 ns |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of Gates | 200000 |
| Speed Grade | 5 |
| Number of Registers | 448 |
| Combinatorial Delay of a CLB-Max | 0.62 ns |
| Number of CLBs | 448 |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
XC3S200AN-5FTG256C Overview
A 256-LBGA package contains it, and it is available for download. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 195 I/Os help it transfer data more efficiently. A fundamental building block is made up of 4032 logic elements/cells. It is powered from a supply voltage of 1.2V. There is a Field Programmable Gate Arrays family component in this FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . It is a type of FPGA belonging to the Spartan?-3AN seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. With this device, you will be able to make use of 160 outputs. As a result of space limitations, this FPGA model has been included in Tray. In total, there are a total of 256 terminations on fpga chips. The RAM bits that this device offer is 294912. If you are looking for related parts, you can use the base part number XC3S200AN as a starting point. For the program to work properly, the RAM si36kBe of this FPGA module must reach 36kB GB in order to ensure normal operation. The device is designed with 256 pins in total. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. Power is provided by a 1.21.2/3.33.3V battery that is included with the device. As a basic building block, fpga semiconductor consists of 200000 gates. With a total of 256 pins, it is equipped with a high level of security. Typically, fpga semiconductor uses a crystal oscillating at 770MHz . As a result, there are 448 registers which are used to store and transfer data. The architecture of the system is based on 448 CLBs.
XC3S200AN-5FTG256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
448 registers
XC3S200AN-5FTG256C Applications
There are a lot of Xilinx Inc. XC3S200AN-5FTG256C FPGAs applications.
- Automotive
- Random logic
- Electronic Warfare
- Audio
- Device controllers
- Defense Applications
- Aerospace and Defense
- Medical imaging
- Consumer Electronics
- Automotive Applications
