XC3S400-4FG456C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 456-BBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Bulk |
| Published | 2009 |
| Series | Spartan®-3 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 456 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 456 |
| Number of Outputs | 264 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 264 |
| RAM Size | 36kB |
| Clock Frequency | 630MHz |
| Number of Inputs | 264 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 8064 |
| Total RAM Bits | 294912 |
| Number of Gates | 400000 |
| Number of LABs/CLBs | 896 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Number of CLBs | 896 |
| Height Seated (Max) | 2.6mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | Non-RoHS Compliant |
XC3S400-4FG456C Overview
In the 456-BBGA package, you will find fpga chips. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 264 I/Os allow data to be transferred in a more coherent manner. Logic blocks consist of 8064 logic elements/cells. Power is provided by a 1.2V-volt supply. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. It is a type of FPGA that belongs to the Spartan?-3 series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. A total of 264 outputs are incorporated into this device. As a result of space limitations, this FPGA model has been included in Bulk. In total, it has 456 terminations on each end. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 294912 bFpga chipss. During the configuration of this FPGA module, the RAM si36kBe reaches 36kB to ensure that the program runs normally. 896 LABs/CLBs are integrated into this FPGA. Designers can fully utilize its flexibility with 1.2V supply voltage. Fpga electronics operates from a 1.21.2/3.32.5V power supply. A basic building block for this type of building block consists of 400000 gates. Featuring 456 pins in total, it is a versatile device. Fpga semiconductor typically uses a crystal oscillating at 630MHz. CLBs are the building blocks of its architecture.
XC3S400-4FG456C Features
264 I/Os
Up to 294912 RAM bits
XC3S400-4FG456C Applications
There are a lot of Xilinx Inc. XC3S400-4FG456C FPGAs applications.
- Radar and Sensors
- Video & Image Processing
- Scientific Instruments
- Data Mining
- Defense Applications
- Secure Communication
- Distributed Monetary Systems
- Automotive driver's assistance
- Server Applications
- Integrating multiple SPLDs
