XC3S400-4FTG256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Spartan®-3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S400 |
| Pin Count | 256 |
| Number of Outputs | 173 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 173 |
| RAM Size | 36kB |
| Clock Frequency | 630MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 8064 |
| Total RAM Bits | 294912 |
| Number of Gates | 400000 |
| Number of LABs/CLBs | 896 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.61 ns |
| Number of CLBs | 896 |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
XC3S400-4FTG256I Overview
Fpga chips is supplied in the 256-LBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 173 I/Os for better data transfer. A fundamental building block consists of 8064 logic elements/cells. The supply voltage is 1.2V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. There are many types of FPGAs in the Spartan?-3 series, this is one of them. The operating temperature should be kept at -40°C~100°C TJ when operating. In this device, 173 outputs are incorporated in order to provide you with maximum flexibility. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, the terminations of this piece are 256. As far as the RAM bits are concerned, this device offers you a total of 294912. In order to find related parts, use the part number XC3S400 as a base. It is crucial that the RAM si36kBe of this FPGA module reaches 36kB so that the program can run normally. In this case, there are 256 pins on the board. 896 LABs and CLBs are built into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. The building block that forms the basis of the system contains 400000 gates. There are a total of 256 pins on this device. Most of the time, it uses a crystal oscillating at 630MHz to generate the signal. An architecture consists of 896 CLBs.
XC3S400-4FTG256I Features
173 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
XC3S400-4FTG256I Applications
There are a lot of Xilinx Inc. XC3S400-4FTG256I FPGAs applications.
- Enterprise networking
- Automation
- Integrating multiple SPLDs
- Filtering and communication encoding
- Device controllers
- OpenCL
- Cryptography
- Automotive Applications
- Software-defined radio
- Medical Electronics
