XC3S700A-4FGG400I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 400-BGA |
| Number of Pins | 400 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3A |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 400 |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S700A |
| Pin Count | 400 |
| Number of Outputs | 248 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.22.5/3.3V |
| Number of I/O | 311 |
| RAM Size | 45kB |
| Clock Frequency | 667MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of Gates | 700000 |
| Number of LABs/CLBs | 1472 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Length | 21mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |
XC3S700A-4FGG400I Overview
There are two packages that contain fpga chips: 400-BGA package and X package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 311 I/Os for transferring data in a more coherent manner. Logic blocks consist of 13248 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan?-3A seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. During the installation of this device, 248 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, it has 400 terminations on each end. This device is equipped with 368640 RAM bits in terms of its RAM si368640e. XC3S700A is the base part number that can be used to identify related parts. The RAM si45kBe of this FPGA module reaches 45kB so as to guarantee the normal operation of the program during operation. In this case, 400 pins are used in the design. This FPGA is built as an array of 1472 LABs/CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. An external power supply of 1.22.5/3.3V is required to power the device. The building block that forms the basis of the system contains 700000 gates. As far as the pin count is concerned, it has 400 pins. Usually, fpga semiconductor uses a 667MHz crystal.
XC3S700A-4FGG400I Features
311 I/Os
Up to 368640 RAM bits
400 LABs/CLBs
XC3S700A-4FGG400I Applications
There are a lot of Xilinx Inc. XC3S700A-4FGG400I FPGAs applications.
- Automation
- Space Applications
- Aircraft navigation
- Digital signal processing
- Computer hardware emulation
- Electronic Warfare
- Radar and Sensors
- Bioinformatics
- Data Mining
- Consumer Electronics
