XC3S700A-4FTG256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3A |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S700A |
| Pin Count | 256 |
| Number of Outputs | 148 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 161 |
| RAM Size | 45kB |
| Clock Frequency | 667MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of Gates | 700000 |
| Number of LABs/CLBs | 1472 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
XC3S700A-4FTG256I Overview
In the 256-LBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. This device features 161 I/Os in order to transfer data in a more efficient manner. The basic building blocks of logic contain 13248 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. This FPGA part belongs to the family of Field Programmable Gate Arrays. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. An FPGA belonging to the Spartan?-3A series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. The device has 148 outputs that are integrated into it. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are a total of 256 terminations. As far as the RAM bits are concerned, this device offers you a total of 368640. In order to find related parts, you can use its base part number XC3S700A. This FPGA module has a RAM si45kBe of 45kB that is sufficient to make sure that the program is able to run normally. In this case, there are 256 pins on the board. A total of 1472 LABs/CLBs are included in this FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Powered by a 1.21.2/3.33.3V power supply, it can be operated by almost anyone. The basic building block of this system consists of 700000 gates. In addition to this, it has 256 pins. Fpga semiconductor typically uses a crystal oscillating at 667MHz.
XC3S700A-4FTG256I Features
161 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
XC3S700A-4FTG256I Applications
There are a lot of Xilinx Inc. XC3S700A-4FTG256I FPGAs applications.
- Automotive
- Electronic Warfare
- ADAS
- Development Boards and Shields for Microcontrollers
- Scientific Instruments
- Camera time adjustments
- Integrating multiple SPLDs
- Filtering and communication encoding
- Data center hardware accelerators
- Radar and Sensors
