XC3S700AN-4FGG484I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 484-BBGA |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Spartan®-3AN |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Termination | SMD/SMT |
| ECCN Code | 3A991.D |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S700AN |
| Pin Count | 484 |
| Number of Outputs | 288 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Number of I/O | 372 |
| RAM Size | 45kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 13248 |
| Total RAM Bits | 368640 |
| Number of Gates | 700000 |
| Number of LABs/CLBs | 1472 |
| Speed Grade | 4 |
| Combinatorial Delay of a CLB-Max | 0.71 ns |
| Height Seated (Max) | 2.6mm |
| Length | 23mm |
| Width | 23mm |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
XC3S700AN-4FGG484I Overview
As part of the 484-BBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 372 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 13248 logic elements or cells. Fpga chips is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Spartan?-3AN series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. During the installation of this device, 288 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As a whole, it has 484 terminations. The RAM bits that this device offer is 368640. If you are looking for related parts, you can use the base part number XC3S700AN as a starting point. The RAM si45kBe of this FPGA module reaches 45kB to ensure normal operation of the program. 484 pins are designed into the device. The FPGA is built as an array of 1472 latches or CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. Power is provided by a 1.21.2/3.33.3V battery that is included with the device. The basic building block of this system consists of 700000 gates. I am going to present you with a device that is equipped with 484 pins. Fpga semiconductor operates at a frequency of 667MHz to deliver high efficiency.
XC3S700AN-4FGG484I Features
372 I/Os
Up to 368640 RAM bits
484 LABs/CLBs
Operating from a frequency of 667MHz
XC3S700AN-4FGG484I Applications
There are a lot of Xilinx Inc. XC3S700AN-4FGG484I FPGAs applications.
- Automotive Applications
- Radar and Sensors
- Ecosystem
- Aerospace and Defense
- Embedded Vision
- Artificial intelligence (AI)
- Defense Applications
- Camera time adjustments
- Bioinformatics
- Secure Communication
